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FUNMAT PRO 410 Service Guide
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Chapter 1 - Error and diagnosis
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01.
E301 - L-Nozzle temperature is too high
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02.
E302 - R-Nozzle temperature is too high
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03.
E303 - Build-plate temperature is too high
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04.
E304 - Chamber temperature is too high
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05.
E306 - Left nozzle temperature is too low
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06.
E105-Temperature of filament chamber is too high
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07.
E307 - Right nozzle temperature is too low
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08.
E308 - Build-plate temperature is too low
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09.
E309 - Chamber temperature is too low
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10.
E310 - Left nozzle temperature does not change during heating
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11.
E311 - Right nozzle temperature does not change during heating
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12.
E312 - L-nozzle heating speed is too low
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13.
E313 - R-nozzle heating speed is too low
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14.
E416-The device is powered off or the voltage is unstable during printing
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15.
E217 - L-failment is out of material
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16.
E218 - R-filament is out of materail
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17.
E219- L-nozzle extrusion is abnormal
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18.
E220- R-nozzle extrusion is abnormal
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19.
E221 - The front door of the chamber is not closed
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20.
E222 - The top door of the chamber is not closed
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21.
E123 - The door of filament chamber is not closed
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22.
E224 - L-Extruder limit sensor is abnormal
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23.
E225 - R-Extruder limit sensor is abnormal
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24.
E129 - cooling liquid temperature is high
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25.
E130 - L-filament weight is probably not enough
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26.
E131 - R-filament weight is probably not enough
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27.
E332 - X limit sensor is triggered
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28.
E333 - Y limit sensor is triggered
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29.
E334 - Z limit sensor is triggered
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30.
E235 - L-nozzle leveling sensor is triggered
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31.
E237-Cooling liquid temperature is high
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32.
E238-Cooling liquid temperature is low
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33.
E252-liquid tank temperature sensor is broken
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34.
E253-liquid tank temperature sensor is short circuit
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35.
E254-liquid tank temperature sensor is low
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36.
E256-liquid flow is low
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37.
E257-cooling liquid is abnormal
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38.
E370/371-Serial COM error
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39.
E171 - Serial COM error
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Chapter 2 - Common Issues & Tips
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01. Nozzle Clogging
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02. Build-plate adhesion issue
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03. Layer Separation
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04. Stringing Issue
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05. Under Extrusion
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06. Layer Shift
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07. Random Protrusion on Surface
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08. Prime Tower and Collapse Issue
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09. Z-Seam Issue (Z-Weld Point Alignment)
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10. Purpose of Nozzle Cooling Fan
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11. Purpose of Chamber Heating
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12. Support and Overhand
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Chapter 3 - Parts disassembling
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Section 1. Surrounding Components
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1.1
Top Door Air Spring
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1.2
Touch Screen, USB Port & Power-On Button
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1.3
Top Door Interlock & Sensor
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1.4
Motor Driver
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1.5
Main Board & UPS Board
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1.6
24VDC Power Supply & Capacity
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1.7
Touch Screen, USB Port & Power on Button
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Section 2. Extruder Assembly
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2.1
Extruder Assembly
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2.2
Nozzle set, Hot end, Heating, Cartridge, T Sensor
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2.3
Feed Motor
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2.4
Nozzle switch motor & right nozzle lifter
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2.5
Encoder, Nozzle switch sensor, Auto-leveling sensor
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Section 3. Chiller
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3.1
Chiller
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3.2
Coolant Temperature Sensor
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3.3
settings of Chiller
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Section 4. Printing Chamber
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4.1
Chamber Heater
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4.2
Heating fans(blower)
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4.3
Temperature sensor of printing chamber
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4.4
build-plate Heater
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4.5
Nozzle Cleaning station(scraper & brush)
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Section 5. Filament Chamber
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5.1
Filament I/O Board
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5.2
Filament feed motor (filament chamber)
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5.3
Heaters&fans in filament chamber ,fuse for the Heaters in main board
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5.4
Temperature sensor in filament chamber
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5.5
Filament Absence Sensor
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Section 5.
Motion Structure
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6.1
Driving motor-Z Axis ,Z limit sensor &Activation flag
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6.2
Driving motor-Y Axis,Y limit sensor
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6.3
Rails-Y Axis
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6.4
Y Axis-Limit sensor
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6.5
X motor
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6.6
X limit sensor
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6.7
Rails-X Axis
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Chapter 4 - Operations
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1.
Upgrade firmware of lower computer (Main Board)
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2.
Upgrade software of upper computer